?DEVELOPMENT OF BIMETAL TEST SPECIMEN FOR TESTING MATERIALS AT HIGH HOMOLOGOUS TEMPERATURE

Authors

  • MOHAMMAD JAVED HYDER Mechanical Engineering Department, Rensselaer Polytechnic Institute, Troy, New York 12180-3590, USA
  • DAVID A. WOODFORD Mechanical Engineering Department, Rensselaer Polytechnic Institute, Troy, New York 12180-3590, USA

Keywords:

Test specimen, Fatigue, Creep.

Abstract

A bimetal test specimen has been developed to be used for testing materials at high homologous temperatures.
The testing material selected is 50/50 lead-tis solder. At room temperature its homologous temperature is 0.6.
Specimen manufacturing method adopted is simple and economical. OFHC copper has been used as a rigid support
to install extensometer for strain measurements and to hold the specimen by the testing machine grips. Copper has
been used because it provides a strong bond with solder and it is easy to manufacture copper to the required shape
and size. The strain produced in the copper is 123 times less than that produced in solder.Formula has been devel-
oped to calculate the strain produced in the gage section using the strain value measured using extensometer in-
stalled on copper.

Published

1995-08-21

How to Cite

HYDER, M. J., & WOODFORD, D. A. (1995). ?DEVELOPMENT OF BIMETAL TEST SPECIMEN FOR TESTING MATERIALS AT HIGH HOMOLOGOUS TEMPERATURE. Biological Sciences - PJSIR, 38(7), 241–245. Retrieved from https://v2.pjsir.org/index.php/biological-sciences/article/view/2485

Issue

Vol. 38 No. 7 (1995): Pakistan Journal of Scientific and Industrial Research

Section

Articles